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Lead-Free Soldering

Lead-Free Soldering

Jennifer Shepherd (auth.), Jasbir Bath (eds.)
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The push toward lead-free soldering in computers, cell phones and other electronic and electrical devices has taken on a greater urgency as laws have been passed or are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled, and specifically affect process engineering, manufacturing and quality assurance.

Lead-Free Soldering offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.

Written by recognized experts in both academia and industry, Lead-Free Soldering is a must-have guide for practicing engineers interested in the latest developments surrounding areas such as lead-free alloy properties, reflow, wave, rework , solder joint reliability, PCB laminates and surface finishes, and backward and forward compatibility.

類別:
年:
2007
版本:
1
出版商:
Springer US
語言:
english
頁數:
299
ISBN 10:
0387684220
ISBN 13:
9780387684222
文件:
PDF, 9.03 MB
IPFS:
CID , CID Blake2b
english, 2007
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